Through-transmission and contact-less scanning of materials to detect defects or damages about few mm to cm size (frequency : 50 kHz to 500 kHz)
Contact-less (or dry contact) generation and detection of SH guided wave modes to inspect adhesive bonds in large composite components.
CEFIPRA & ARIANE GROUP
Partnership with IIT Madras and IISc Bangalore, India
3-axis test bench with a normal velocity LDV system.
Feature guided wave modes propagating along a stiffener adhesively-bonded on a composite panel. Monitoring of ultrasonic scattered field to detect, locate and image a defect in the adhesive bond.
Partnership with NTU, Singapore
Mise à jour le 03/04/2018